| Alumina (Al₂O₃) |
Approximately 1,600–1,800 °C, depending on purity and design |
Many oxides, glass-forming materials, noble metals, nickel-based alloys, and numerous high-temperature inorganic compounds |
Air, oxygen, inert gas, and many vacuum applications |
Excellent for many oxides |
Can be attacked by hydrofluoric acid, molten fluorides, concentrated alkalis, and some highly reactive melts. May contaminate very sensitive materials with small amounts of aluminum. |
| High-Purity Graphite |
Approximately 2,000–3,000 °C in inert gas or vacuum; much lower in air |
Gold, silver, copper, many nonferrous alloys, silicon, and some carbide-forming materials when carbon pickup is acceptable |
Vacuum, argon, helium, or other oxygen-free atmospheres |
Good under reducing conditions |
Oxidizes in air at elevated temperature. Carbon can dissolve into or react with iron, cobalt, nickel, silicon, and some carbide-forming melts. Not suitable when carbon contamination must be avoided. |
| Silicon Carbide (SiC) |
Approximately 1,400–1,600 °C in air; higher in controlled atmospheres depending on construction |
Nonferrous metals, aluminum alloys, copper alloys, zinc alloys, and some salts and oxides |
Air, inert gas, and reducing atmospheres, subject to oxidation control |
Good for many nonferrous melts |
May react with strongly oxidizing materials and some molten salts. Silicon or carbon transfer can affect highly sensitive melts. Thermal-shock resistance is often good, but mechanical handling remains important. |
| Boron Nitride (BN) |
Approximately 1,800–2,000 °C in inert gas or vacuum; lower in oxidizing atmospheres |
Aluminum, gallium, indium, boron-containing materials, semiconductor-related melts, and reactive melts requiring low wetting |
Vacuum, nitrogen, argon, and other oxygen-limited atmospheres |
Excellent non-wetting behavior |
Oxidizes in air at high temperature. Can be attacked by some molten alkalis, borates, and oxidizing compounds. Avoid prolonged exposure to oxygen-rich atmospheres at elevated temperature. |
| Zirconia (ZrO₂) |
Approximately 2,000–2,400 °C, depending on stabilization and thermal cycling |
Molten oxides, superalloy-related materials, platinum-group metals, and melts requiring very low silica contamination |
Air, inert gas, and vacuum; application-specific testing is recommended |
Excellent for many aggressive melts |
Stabilized grades are preferred for thermal cycling. Some alkali-containing melts and reducing conditions can cause chemical or structural degradation. Thermal expansion is relatively high. |
| Magnesia (MgO) |
Approximately 1,700–2,200 °C, depending on purity and atmosphere |
Basic oxides, iron-containing materials, certain slags, and some high-temperature metallurgical melts |
Air, inert gas, and many high-temperature furnace atmospheres |
Good with basic materials |
Can react with acidic oxides such as silica-rich compositions. Hydration during storage or handling may weaken the material. Thermal shock and mechanical strength vary by grade. |
| Mullite (Al₂O₃–SiO₂) |
Approximately 1,500–1,700 °C |
Glasses, ceramics, oxides, and general laboratory heating applications |
Air and inert gas |
Good for general oxide work |
Silica-containing compositions may introduce contamination. Not the first choice for strongly alkaline, fluoride-containing, or highly reactive melts. |
| Fused Silica (SiO₂) |
Approximately 1,000–1,200 °C for long-term use; higher temperatures may be possible briefly |
Many laboratory glasses, low-alkali oxides, and selected analytical samples |
Air, inert gas, and vacuum |
Conditionally compatible |
Excellent thermal-shock resistance but limited chemical compatibility with hydrofluoric acid, hot concentrated alkalis, and some metallic oxides. Softens at temperatures approaching its working limit. |
| Platinum-Group Metal |
Approximately 1,200–1,800 °C, depending on the metal, geometry, and atmosphere |
Oxides, glasses, borates, phosphates, and analytical fusion mixtures that do not attack the selected metal |
Air, oxygen, inert gas, and some controlled atmospheres |
Excellent for selected analytical melts |
Can be attacked by molten alkali cyanides, sulfides, halides, lead- or bismuth-containing materials, and some reducing melts. High cost makes chemical screening essential. |
| Vitreous Carbon |
Approximately 1,000–2,000 °C in inert gas or vacuum, depending on grade |
Electrochemical materials, selected metals, oxides, and melts requiring a smooth, low-porosity carbon surface |
Vacuum, argon, helium, and other oxygen-free atmospheres |
Good in oxygen-free conditions |
Oxidizes in air at elevated temperature. Carbon contamination and reactions with carbide-forming elements must be considered. It can be brittle and sensitive to mechanical shock. |
| Metallic Steel or Nickel Alloy |
Approximately 700–1,400 °C, depending on alloy and exposure time |
Selected low-melting metals, salts, and industrial melts that do not alloy with the crucible |
Air, inert gas, or reducing atmosphere according to alloy requirements |
Highly composition-dependent |
May dissolve, alloy, oxidize, or introduce iron, nickel, chromium, or other constituents. Avoid direct use with melts containing strong oxidizers, sulfur, halides, or metals that readily alloy with the crucible. |
| Porcelain or Steatite Ceramic |
Approximately 1,000–1,400 °C, depending on composition |
Routine laboratory heating, salts, oxides, and low-to-moderate temperature inorganic compounds |
Air and inert gas |
Suitable for mild applications |
Porosity and glaze composition can affect contamination and wetting. Not recommended for aggressive fluorides, concentrated alkalis, or highly reactive molten metals. |